Invention Grant
- Patent Title: Process for precision placement of integrated circuit overcoat material
- Patent Title (中): 集成电路外套材料精密放置的工艺
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Application No.: US11464080Application Date: 2006-08-11
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Publication No.: US07648857B2Publication Date: 2010-01-19
- Inventor: Sean M. Malolepszy , Rex W. Pirkle
- Applicant: Sean M. Malolepszy , Rex W. Pirkle
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/58 ; H01R43/00 ; B05D5/12
Abstract:
The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.
Public/Granted literature
- US20080036046A1 PROCESS FOR PRECISION PLACEMENT OF INTEGRATED CIRCUIT OVERCOAT MATERIAL Public/Granted day:2008-02-14
Information query
IPC分类:
