Invention Grant
- Patent Title: Microcomponent comprising a hermetically-sealed microcavity and method for production of such a microcomponent
- Patent Title (中): 微组件包括密封的微腔和用于生产这种微组件的方法
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Application No.: US10582343Application Date: 2004-12-14
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Publication No.: US07648859B2Publication Date: 2010-01-19
- Inventor: Philippe Robert
- Applicant: Philippe Robert
- Applicant Address: FR Paris
- Assignee: Commissariat A l'Energie Atomique
- Current Assignee: Commissariat A l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0315029 20031219
- International Application: PCT/FR2004/003216 WO 20041214
- International Announcement: WO2005/061374 WO 20050707
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/311 ; H01L23/04
Abstract:
The microcavity is delineated by a cover, comprising a first layer, in which at least one hole is formed. A second layer hermetically seals the microcavity. A third layer is arranged between the first and the second layer. An additional microcavity, communicating with the hole, is arranged between the first and the third layer. At least one additional hole, adjacent to the additional microcavity, formed in the third layer and offset with respect to the hole, is sealed by the second layer, after sacrificial layers have been removed through the additional hole. The microcomponent includes at least one mechanically stressed layer arranged above the first layer.
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