Invention Grant
US07648868B2 Metal-gated MOSFET devices having scaled gate stack thickness
失效
具有缩放栅堆叠厚度的金属门控MOSFET器件
- Patent Title: Metal-gated MOSFET devices having scaled gate stack thickness
- Patent Title (中): 具有缩放栅堆叠厚度的金属门控MOSFET器件
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Application No.: US11931033Application Date: 2007-10-31
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Publication No.: US07648868B2Publication Date: 2010-01-19
- Inventor: Amlan Majumdar , Renee Tong Mo , Zhibin Ren , Jeffrey Sleight
- Applicant: Amlan Majumdar , Renee Tong Mo , Zhibin Ren , Jeffrey Sleight
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Vazken Alexanian; Michael J. Chang, LLC
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234 ; H01L21/8238

Abstract:
Metal-oxide semiconductor field effect transistor (MOSFET) devices having metal gate stacks and techniques for improving performance thereof are provided. In one aspect, a metal-oxide semiconductor device is provided comprising a substrate having a buried oxide layer at least a portion of which is configured to serve as a primary background oxygen getterer of the device; and a gate stack separated from the substrate by an interfacial oxide layer. The gate stack comprises a high-K layer over the interfacial oxide layer; and a metal gate layer over the high-K layer.
Public/Granted literature
- US20090108352A1 Metal-Gated MOSFET Devices Having Scaled Gate Stack Thickness Public/Granted day:2009-04-30
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