Invention Grant
- Patent Title: Manufacturing process and apparatus therefor utilizing reducing gas
- Patent Title (中): 利用还原气的制造方法及其装置
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Application No.: US11536051Application Date: 2006-09-28
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Publication No.: US07648901B2Publication Date: 2010-01-19
- Inventor: Ping Liang Tu , Deming Liu , Kui Kam Lam , Man Chung Raymond Ng
- Applicant: Ping Liang Tu , Deming Liu , Kui Kam Lam , Man Chung Raymond Ng
- Applicant Address: HK Hong Kong
- Assignee: ASM Assembly Automation Ltd.
- Current Assignee: ASM Assembly Automation Ltd.
- Current Assignee Address: HK Hong Kong
- Agency: Ostrolenk Faber LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.
Public/Granted literature
- US20080078145A1 MANUFACTURING PROCESS AND APPARATUS THEREFOR UTILIZING REDUCING GAS Public/Granted day:2008-04-03
Information query
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