Invention Grant
- Patent Title: Method and apparatus for processing a conductive thin film
- Patent Title (中): 用于处理导电薄膜的方法和装置
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Application No.: US11330520Application Date: 2006-01-11
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Publication No.: US07648906B2Publication Date: 2010-01-19
- Inventor: Koji Takei , Sumihiro Ichikawa , Yasunari Suzuki , Ryo Fukasawa , Daisuke Matono
- Applicant: Koji Takei , Sumihiro Ichikawa , Yasunari Suzuki , Ryo Fukasawa , Daisuke Matono
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Locke Lord Bissell & Liddell LLP
- Priority: JP2005-010072 20050118; JP2005-320856 20051104
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/20 ; H01L21/00
Abstract:
A method and apparatus for processing a thin film able to easily form grooves in a conductive thin film on an insulating substrate, comprising bringing a first electrode into contact with the conductive thin film, maintaining a conductive state between a tip of a second electrode with a voltage applied with respect to the first electrode and the surface of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.
Public/Granted literature
- US20060160340A1 Method and apparatus for processing a conductive thin film Public/Granted day:2006-07-20
Information query
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