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US07648907B2 Semiconductor device, wiring substrate forming method, and substrate processing apparatus 有权
半导体装置，布线基板的形成方法以及基板处理装置

Semiconductor device, wiring substrate forming method, and substrate processing apparatus
Abstract:
A substrate support (201) having a flat supporting surface (201a) is prepared, and a semiconductor substrate (1) is fixed to the substrate supporting surface (201) by attaching a wiring forming surface (1a) to the supporting surface (201a) by suction, for example, by vacuum suction. On this occasion, the wiring forming surface (1a) is forcibly flattened by being attached to the supporting surface (201a) by suction, and therefore the wiring forming surface (1a) becomes a reference plane for planarization of a back surface (1b). In this state, planarization processing is performed by mechanically grinding the back surface (1b) to grind away projecting portions (12) of the back surface (1b). Hence, variations in the thickness of the substrate (especially, semiconductor substrate) are made uniform, and high-speed planarization is realized easily and inexpensively without disadvantages such as dishing and without any limitation on a wiring design.
Abstract(Chinese):

制备具有平坦支撑面（201a）的基板支撑体（201），通过将布线形成面（1a）安装在支撑面（201a）上而将半导体基板（1）固定在基板支撑面（201） 通过抽吸，例如通过真空抽吸。 在这种情况下，布线形成表面（1a）通过抽吸附接到支撑表面（201a）而被强制地平坦化，因此布线形成表面（1a）成为用于平面化背面（1b）的参考平面。 在这种状态下，通过机械研磨后表面（1b）以去除后表面（1b）的突出部分（12）来进行平面化处理。 因此，基板（特别是半导体基板）的厚度的变化是均匀的，并且容易且廉价地实现高速平坦化，而没有诸如凹陷的缺点，并且对布线设计没有任何限制。

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