Method of manufacturing spacer

Invention Grant

US07648924B2 Method of manufacturing spacer 有权

Title translation: 垫片的制造方法

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Patent Title: Method of manufacturing spacer
Patent Title (中): 垫片的制造方法
Application No.: US11694437

Application Date: 2007-03-30
Publication No.: US07648924B2

Publication Date: 2010-01-19
Inventor: Kuo-Liang Wei
Applicant: Kuo-Liang Wei
Applicant Address: TW Hsinchu
Assignee: MACRONIX International Co., Ltd.
Current Assignee: MACRONIX International Co., Ltd.
Current Assignee Address: TW Hsinchu
Agency: J.C. Patents
Main IPC: H01L21/31
IPC: H01L21/31

Abstract:

A method of manufacturing an L-shaped spacer is described. First, a substrate is provided and a protruding structure is formed thereon. Next, a dielectric material is formed on the substrate and covers the stacked structure. Then, the dielectric material on the top of the protruding structure and on portions of the substrate is removed to form an L-shaped spacer.

Abstract(Chinese):

描述制造L形间隔件的方法。首先，提供基板并在其上形成突出结构。接下来，在基板上形成电介质材料并覆盖堆叠结构。然后，将突出结构的顶部和基板的部分上的电介质材料去除以形成L形间隔件。

Public/Granted literature

US20080242092A1 METHOD OF MANUFACTURING SPACER Public/Granted day:2008-10-02

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择