Invention Grant
- Patent Title: Multilayer barrier stacks and methods of making multilayer barrier stacks
- Patent Title (中): 多层阻挡层叠层及其制备方法
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Application No.: US11776616Application Date: 2007-07-12
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Publication No.: US07648925B2Publication Date: 2010-01-19
- Inventor: Lorenza Moro , Xi Chu
- Applicant: Lorenza Moro , Xi Chu
- Applicant Address: US CA San Jose
- Assignee: Vitex Systems, Inc.
- Current Assignee: Vitex Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Dinsmore & Shohl LLP
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469

Abstract:
An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.
Public/Granted literature
- US20070281174A1 MULTILAYER BARRIER STACKS AND METHODS OF MAKING MULTILAYER BARRIER STACKS Public/Granted day:2007-12-06
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