Invention Grant
- Patent Title: Circuit board via arrangement for differential signal connector
- Patent Title (中): 电路板通过差分信号连接器布置
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Application No.: US11901284Application Date: 2007-09-14
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Publication No.: US07649146B2Publication Date: 2010-01-19
- Inventor: Hazelton P. Avery , Patrick R. Casher , Richard A. Nelson , Kent E. Regnier
- Applicant: Hazelton P. Avery , Patrick R. Casher , Richard A. Nelson , Kent E. Regnier
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H01R12/04
- IPC: H01R12/04
Abstract:
Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts.
Public/Granted literature
- US20080009147A1 Circuit board via arrangement for differential signal connector Public/Granted day:2008-01-10
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