This semiconductor device includes a first conductivity type first semiconductor layer formed on the upper surface of a substrate, a first conductivity type second semiconductor layer formed on the first semiconductor layer, a first conductivity type third semiconductor layer formed on the second semiconductor layer, a second conductivity type fourth semiconductor layer formed on the third semiconductor layer, a first conductivity type fifth semiconductor layer formed on the fourth semiconductor layer and an electrode formed in a trench, so provided as to reach the second semiconductor layer through at least the fifth semiconductor layer, the fourth semiconductor layer and the third semiconductor layer, in contact with an insulating film, while the upper surface of the second semiconductor layer is arranged upward beyond the lower end of the electrode.