Invention Grant
- Patent Title: Semiconductor device and method of forming the same
- Patent Title (中): 半导体器件及其形成方法
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Application No.: US11594759Application Date: 2006-11-09
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Publication No.: US07649227B2Publication Date: 2010-01-19
- Inventor: Shunpei Yamazaki , Yasuhiko Takemura , Hongyong Zhang
- Applicant: Shunpei Yamazaki , Yasuhiko Takemura , Hongyong Zhang
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP4-073313 19920225; JP4-073315 19920225; JP4-089992 19920313
- Main IPC: H01L27/01
- IPC: H01L27/01

Abstract:
An insulated gate semiconductor device comprising an insulator substrate having provided thereon a source and a drain region; a channel region being incorporated between said source and said drain regions, said channel region comprising a polycrystalline, a single crystal, or a semi-amorphous semiconductor material; and a region provided under said channel region, said region comprising an amorphous material containing the same material as that of the channel region as the principal component, or said region comprising a material having a band gap larger than said channel region.A process for fabricating the device is also disclosed.
Public/Granted literature
- US20070096210A1 Semiconductor device and method of forming the same Public/Granted day:2007-05-03
Information query
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