Invention Grant
- Patent Title: Semiconductor devices
- Patent Title (中): 半导体器件
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Application No.: US12129861Application Date: 2008-05-30
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Publication No.: US07649234B2Publication Date: 2010-01-19
- Inventor: Hongning Yang , Jiang-Kai Zuo
- Applicant: Hongning Yang , Jiang-Kai Zuo
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia, Fisher & Lorenz, P.C.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
An embodiment of a semiconductor device includes a gate electrode overlying a substrate and a lightly doped epitaxial layer formed on the substrate. A high energy implant region forms a well in a source side of the lightly doped epitaxial layer. A self-aligned halo implant region is formed on a source side of the device and within the high energy well implant. An implant region on a drain side of the lightly doped epitaxial layer forms a gate overlapped LDD (GOLD). A doped region within the halo implant region forms a source. A doped region within the gate overlapped LDD (GOLD) forms a drain.
Public/Granted literature
- US20080224237A1 SEMICONDUCTOR DEVICES Public/Granted day:2008-09-18
Information query
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