Invention Grant
- Patent Title: Tab package connecting host device element
- Patent Title (中): 标签包连接主机设备元件
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Application No.: US11396526Application Date: 2006-04-04
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Publication No.: US07649246B2Publication Date: 2010-01-19
- Inventor: Ye-chung Chung , Sa-yoon Kang
- Applicant: Ye-chung Chung , Sa-yoon Kang
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2005-0043810 20050524
- Main IPC: H01L23/495
- IPC: H01L23/495

Abstract:
A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.
Public/Granted literature
- US20060267164A1 Tab package connecting host device element Public/Granted day:2006-11-30
Information query
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