Invention Grant
- Patent Title: Conductive stiffener for a flexible substrate
- Patent Title (中): 用于柔性基板的导电加强件
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Application No.: US11381093Application Date: 2006-05-01
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Publication No.: US07649254B2Publication Date: 2010-01-19
- Inventor: Bhret Graydon , Steve Frandrup
- Applicant: Bhret Graydon , Steve Frandrup
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Marsh Fischmann & Breyfogle, LLP
- Agent Robert G. Crouch; Bobby B. Soltani
- Main IPC: H01L23/49
- IPC: H01L23/49
Abstract:
A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
Public/Granted literature
- US20070254117A1 Conductive Stiffener for a Flexible Substrate Public/Granted day:2007-11-01
Information query
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