Invention Grant
- Patent Title: Semiconductor device including a plurality of wiring lines
- Patent Title (中): 包括多条布线的半导体装置
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Application No.: US11316887Application Date: 2005-12-27
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Publication No.: US07649259B2Publication Date: 2010-01-19
- Inventor: Mizuki Ono , Yuichi Motoi
- Applicant: Mizuki Ono , Yuichi Motoi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-185105 20050624
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A semiconductor device includes a first wiring line group made of a metal, wiring lines of the first wiring line group being arranged in parallel with each other, a second wiring line group which is made of a semiconductor and crosses the first wiring line group, wiring lines of the second wiring line group being arranged in parallel with each other and being movable in the vicinity of each intersection with the wiring lines of the first wiring line group, and a plurality of metal regions which are formed to be joined with the wiring lines constituting the second wiring line group, and have a work function different from that of the metal forming the first wiring line group.
Public/Granted literature
- US20060289996A1 Semiconductor device Public/Granted day:2006-12-28
Information query
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