Invention Grant
- Patent Title: Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof
- Patent Title (中): 具有嵌入和机械锁定的支撑构件的三维微结构及其形成方法
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Application No.: US12005885Application Date: 2007-12-28
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Publication No.: US07649432B2Publication Date: 2010-01-19
- Inventor: David W. Sherrer , Christopher A. Nichols , Shifang Zhou
- Applicant: David W. Sherrer , Christopher A. Nichols , Shifang Zhou
- Applicant Address: US VA Radford
- Assignee: Nuvotornics, LLC
- Current Assignee: Nuvotornics, LLC
- Current Assignee Address: US VA Radford
- Agency: Sherr & Vaughn, PLLC
- Main IPC: H01P3/06
- IPC: H01P3/06
Abstract:
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Public/Granted literature
- US20080191817A1 Three-dimensional microstructures and methods of formation thereof Public/Granted day:2008-08-14
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