In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.