Invention Grant
- Patent Title: Thin-film magnetic head with heating element and heatsink
- Patent Title (中): 带加热元件和散热片的薄膜磁头
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Application No.: US11334009Application Date: 2006-01-18
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Publication No.: US07649713B2Publication Date: 2010-01-19
- Inventor: Norikazu Ota , Katsuki Kurihara , Hiraku Hirabayashi , Taro Oike , Hiroki Matsukuma
- Applicant: Norikazu Ota , Katsuki Kurihara , Hiraku Hirabayashi , Taro Oike , Hiroki Matsukuma
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agent Martin Novack
- Priority: JP2005/188017 20050628
- Main IPC: G11B5/127
- IPC: G11B5/127

Abstract:
A thin-film magnetic head that has an improved protrusion efficiency under the condition of not only assuring the reliability of the-heating operation, but also stabilizing the read output is provided. The head comprises: a magnetic head element for writing and/or reading data signals; a heating element for generating heat at least during operations of the magnetic head element; and a first heatsink element provided adjacent to the heating element for receiving a part of the heat generated from the heating element, the first heatsink element being a distance from the magnetic head element.
Public/Granted literature
- US20060291098A1 Thin-film magnetic head with heating element and heatsink Public/Granted day:2006-12-28
Information query
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