A magnetic head assembly is provided. The magnetic head assembly includes a slider in which a head element is mounted. A flexure supports the slider. The flexure includes a pair of outriggers, a connection portion, and a tongue portion. A flexible wiring substrate is fixedly bonded to the surface of the flexure. An electrode pad of the slider and an electrode pad of the flexible wiring substrate are bonded to each other by solder. A plurality of solder bonded portions are arranged on the connection portion. A deformable portion is formed in the pair of outriggers and located on an extended line on which the solder bonded portions are arranged, so that the free end side of the flexure is deformable.