In a stacked mounting structure At least a pair of a first connecting terminal and a second connecting terminal is formed, and further, the stacked mounting structure includes a protruding electrode which is provided on at least any one of the first connecting terminal and the second connecting terminal, and an electroconductive paste which is formed on a side surface of an intermediate substrate, and which electrically connects the first connecting terminal and the second connecting terminal. The first connecting terminal and the second connecting terminal are exposed by a recess in a surface of the intermediate substrate. The first connecting terminal and the second connecting terminal are electrically connected via the protruding electrode and the electroconductive paste in the recess which is provided in the intermediate substrate.