Invention Grant
US07649743B2 Open-frame solid-state drive housing with intrinsic grounding to protect exposed chips
失效
开放式固态驱动器外壳,具有固有的接地保护裸露的芯片
- Patent Title: Open-frame solid-state drive housing with intrinsic grounding to protect exposed chips
- Patent Title (中): 开放式固态驱动器外壳,具有固有的接地保护裸露的芯片
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Application No.: US12043398Application Date: 2008-03-06
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Publication No.: US07649743B2Publication Date: 2010-01-19
- Inventor: Jim Chin-Nan Ni , Charles C. Lee , Frank Yu , Abraham C. Ma , Ming-Shiang Shen
- Applicant: Jim Chin-Nan Ni , Charles C. Lee , Frank Yu , Abraham C. Ma , Ming-Shiang Shen
- Applicant Address: US CA San Jose
- Assignee: Super Talent Electronics, Inc.
- Current Assignee: Super Talent Electronics, Inc.
- Current Assignee Address: US CA San Jose
- Agency: g Patent LLC
- Agent Stuart T. Auvinen
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An open-frame flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips, a controller chip, and a Serial AT-Attachment (SATA) connector soldered to it. The PCBA is only partially encased by left and right frames or by a U-shaped bracket frame. The frames have PCBA supports and guide posts that fit near edges of the PCBA. The frames do not cover the top and bottom of the PCBA, allowing chips on the PCBA to be ventilated by unblocked air flow. Screws that attach the PCBA to the frame have metal collars that ground the frame to the PCBA's ground plane. The screws form a current path to draw any electro-static-discharge (ESD) current off the frame and onto a PCBA ground. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the open frame.
Public/Granted literature
- US20080198545A1 Open-frame solid-state drive housing with intrinsic grounding to protect exposed chips Public/Granted day:2008-08-21
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