A semiconductor device with an inductor device is small, thin, and low-cost. A laminated inductor is adhered fixedly onto a supporting conductive plate by Ag paste, and a semiconductor chip is adhered fixedly onto the laminated inductor via an insulating DAF tape. One end of the supporting conductive plate and a terminal electrode of the semiconductor chip are connected by a metal wire, and a plurality of terminal electrodes of the semiconductor chip and a plurality of external lead-out terminals are connected respectively by laterally extending metal wires. The entire structure is then sealed by a resin mold. By employing a laminated inductor and forming the metal wires to extend laterally in this manner, the thickness of the semiconductor device with an inductor can be reduced.