Invention Grant
- Patent Title: Multiple layer alignment sensing
- Patent Title (中): 多层对齐检测
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Application No.: US10995840Application Date: 2004-11-23
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Publication No.: US07650029B2Publication Date: 2010-01-19
- Inventor: Carl E. Picciotto , Jun Gao
- Applicant: Carl E. Picciotto , Jun Gao
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
Using an imaging system in relation to a plurality of material layers is described, the material layers being separated by a distance greater than a depth of field of the imaging system. A focal plane of the imaging system and a first of the plurality of material layers are brought into correspondence. A first image including at least a portion of the first material layer having a first feature of interest thereon is stored. The focal plane of the imaging system and a second of the plurality of material layers are brought into correspondence. A second image including at least a portion of the second material layer having a second feature of interest thereon is acquired. The first and second images are processed for automatic computation of an alignment measurement between the first and second features of interest.
Public/Granted literature
- US20060110070A1 Multiple layer alignment sensing Public/Granted day:2006-05-25
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