Invention Grant
- Patent Title: Semiconductor integrated circuit device and high frequency power amplifier module
- Patent Title (中): 半导体集成电路器件和高频功率放大器模块
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Application No.: US11511300Application Date: 2006-08-29
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Publication No.: US07650133B2Publication Date: 2010-01-19
- Inventor: Toshihiro Miura , Hitoshi Akamine , Yasushi Shigeno , Akishige Nakajima , Masahiro Tsuchiya
- Applicant: Toshihiro Miura , Hitoshi Akamine , Yasushi Shigeno , Akishige Nakajima , Masahiro Tsuchiya
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, P.C.
- Priority: JP2005-250183 20050830
- Main IPC: H04B1/16
- IPC: H04B1/16

Abstract:
Switching characteristics in an SPDT switch are improved to reduce the rise delay in a low power slot following after a high power slot. Control terminals of an SPDT switch are respectively provided with backflow prevention circuits. The backflow prevention circuit is configured to have two transistors and a diode. In a transmission mode, for example, when a time slot where a high power passes through transistors is followed by a time slot where a low power passes through, the electric charges accumulated in the gates of the transistors are blocked. In the case where the transistors are in the OFF state, the electric charges accumulated in the gates of the transistors are immediately discharged to allow the transistors to be completely turned OFF.
Public/Granted literature
- US20070049237A1 Semiconductor integrated circuit device and high frequency power amplifier module Public/Granted day:2007-03-01
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