Invention Grant
- Patent Title: XML specification for electronic data interchange (EDI)
- Patent Title (中): 电子数据交换(EDI)的XML规范
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Application No.: US11303167Application Date: 2005-12-16
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Publication No.: US07650353B2Publication Date: 2010-01-19
- Inventor: Surendra Machiraju , Suraj Gaurav
- Applicant: Surendra Machiraju , Suraj Gaurav
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agency: Senniger Powers LLP
- Main IPC: G06F17/00
- IPC: G06F17/00

Abstract:
Extensible Markup Language (XML) specification for transforming electronic data interchange (EDI) transactions. A collection of EDI data is received in a batch. The batch of EDI data includes a plurality of EDI documents and each of the plurality of EDI documents has at least one EDI transaction corresponding to a transaction type. The EDI transactions included in the EDI documents are identified by decoding the received EDI data according to EDI standards. A consolidated EDI document is generated from the EDI documents in the batch of EDI data. The consolidated EDI document includes the identified EDI transactions organized according to the transaction type.
Public/Granted literature
- US20070143665A1 XML specification for electronic data interchange (EDI) Public/Granted day:2007-06-21
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