Invention Grant
- Patent Title: High speed interface for non-volatile memory
- Patent Title (中): 用于非易失性存储器的高速接口
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Application No.: US11644270Application Date: 2006-12-21
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Publication No.: US07650459B2Publication Date: 2010-01-19
- Inventor: Sean S. Eilert , Rodney R. Rozman
- Applicant: Sean S. Eilert , Rodney R. Rozman
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F12/00
- IPC: G06F12/00

Abstract:
Various embodiments of the invention connect multiple non-volatile memory controllers in a daisy chain manner, so the multiple memory devices may be accessed from a common host controller. Data and control signals may be daisy-chained in this way, so that many memory devices may be connected together, while not increasing the loading on individual signals lines. Transfer with the various memory devices may be interleaved, so that the relatively slow times of the memory devices doesn't slow down the overall throughout of the memory stem.
Public/Granted literature
- US20080155207A1 High speed interface for non-volatile memory Public/Granted day:2008-06-26
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