Invention Grant
US07650693B2 Method of assembling electronic components of an electronic system, and system thus obtained 失效
电子系统的电子部件的组装方法以及由此获得的系统

Method of assembling electronic components of an electronic system, and system thus obtained
Abstract:
An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
Information query
Patent Agency Ranking
0/0