Invention Grant
- Patent Title: Large area substrate transferring method for aligning with horizontal actuation of lever arm
- Patent Title (中): 大面积基板转印方法,用于与杆臂的水平致动对齐
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Application No.: US11621039Application Date: 2007-01-08
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Publication No.: US07651315B2Publication Date: 2010-01-26
- Inventor: Shinichi Kurita , Wendell T. Blonigan , Yoshiaki Tanase
- Applicant: Shinichi Kurita , Wendell T. Blonigan , Yoshiaki Tanase
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B65G47/90
- IPC: B65G47/90 ; B21B39/22

Abstract:
A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.
Public/Granted literature
- US20070140814A1 LARGE AREA SUBSTRATE TRANSFERRING METHOD Public/Granted day:2007-06-21
Information query
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