Invention Grant
- Patent Title: Connector which can be reduced in warpage
- Patent Title (中): 可以减少翘曲的连接器
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Application No.: US11140705Application Date: 2005-05-31
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Publication No.: US07651338B2Publication Date: 2010-01-26
- Inventor: Kunikazu Miyamoto , Kazuomi Sato , Kazuaki Ibaraki , Masao Higuchi , Takeharu Naitou
- Applicant: Kunikazu Miyamoto , Kazuomi Sato , Kazuaki Ibaraki , Masao Higuchi , Takeharu Naitou
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Collard & Roe, P.C.
- Priority: JP2004-161644 20040531; JP2004-296616 20041008
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
In a connector for connecting first and second connection objects faced to each other, a conductive contact includes a holding portion held by an insulator, a first spring portion, and a second spring portion connected to the first spring portion. The first spring portion extends from the holding portion in one direction and has a first contacting portion to be connected to the first connection object. The second spring portion extends in the other direction opposite to the one direction and has a free end provided with a second contacting portion to be connected to the second connection object.
Public/Granted literature
- US20050266741A1 Connector which can be reduced in warpage Public/Granted day:2005-12-01
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