Invention Grant
- Patent Title: IC socket
- Patent Title (中): IC插座
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Application No.: US12284298Application Date: 2008-09-18
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Publication No.: US07651357B2Publication Date: 2010-01-26
- Inventor: Ming-Lun Szu
- Applicant: Ming-Lun Szu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: CN200720046656U 20070918
- Main IPC: H01R13/62
- IPC: H01R13/62

Abstract:
An IC socket comprises an insulative housing having a plurality of periphery walls and a cover pivotally assembled to one end of the insulative housing and adapted to be locked to the insulative housing at the other end. The cover includes a plurality of peripheral edges. The cover also has a plurality of spring arms upwardly extending therefrom and disposed at the edges.
Public/Granted literature
- US20090075499A1 IC socket Public/Granted day:2009-03-19
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