Invention Grant
- Patent Title: Circuit board assembly with light emitting element
- Patent Title (中): 具有发光元件的电路板组件
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Application No.: US11732211Application Date: 2007-04-03
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Publication No.: US07651364B2Publication Date: 2010-01-26
- Inventor: Brian Patrick Costello
- Applicant: Brian Patrick Costello
- Applicant Address: US PA MIddletown
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA MIddletown
- Main IPC: H01R3/00
- IPC: H01R3/00
Abstract:
A circuit board assembly includes a circuit board having opposing first and second surfaces each extending between at least one edge surface that intersects the first and second surfaces. A light emitting element is mounted directly over the edge surface of the circuit board.
Public/Granted literature
- US20080248661A1 Circuit board assembly with light emitting element Public/Granted day:2008-10-09
Information query
