Invention Grant
US07651471B2 Encapsulated medical device and method of examining, curing, and treating internal region of body cavity using encapsulated medical device
有权
封装的医疗装置和使用封装的医疗装置检查，固化和处理体腔内部区域的方法
- Patent Title: Encapsulated medical device and method of examining, curing, and treating internal region of body cavity using encapsulated medical device
- Patent Title (中): 封装的医疗装置和使用封装的医疗装置检查，固化和处理体腔内部区域的方法
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Application No.: US11451914Application Date: 2006-06-13
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Publication No.: US07651471B2Publication Date: 2010-01-26
- Inventor: Takeshi Yokoi , Hironobu Takizawa , Hidetake Segawa , Hideyuki Adachi
- Applicant: Takeshi Yokoi , Hironobu Takizawa , Hidetake Segawa , Hideyuki Adachi
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2001-297703 20010927
- Main IPC: A61B5/117
- IPC: A61B5/117 ; A61B5/103
Abstract:
An encapsulated medical device is passed through the lumen of a body cavity in order to examine, cure, or treat an internal region of the body cavity under the control of the extracorporeal device. A capsule body has a linkage hole bored in the extended portion thereof so that when the capsule body comes into close contact with the internal surface of a body cavity to block the lumen thereof, the linkage hole will realize a fluid passage which allows a fluid such as a gas or humor to flow into the forward and backward parts of the lumen.
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