Invention Grant
- Patent Title: Honeycomb structure and seal material
- Patent Title (中): 蜂窝结构和密封材料
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Application No.: US11389333Application Date: 2006-03-27
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Publication No.: US07651755B2Publication Date: 2010-01-26
- Inventor: Yutaka Yoshida
- Applicant: Yutaka Yoshida
- Applicant Address: JP Gifu
- Assignee: Ibiden, Co., Ltd.
- Current Assignee: Ibiden, Co., Ltd.
- Current Assignee Address: JP Gifu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: WOPCT/JP2005/006532 20050328
- Main IPC: B32B3/12
- IPC: B32B3/12 ; C04B35/00 ; B01D39/06

Abstract:
A honeycomb structure is formed by adhering a plurality of honeycomb units provided with cells to each other through a layer of a seal material layer, in which the layer of the seal material comprises an inorganic binder and oxide particles having a particle size of about 0.01 to about 100 μm.
Public/Granted literature
- US20060216466A1 Honeycomb structure and seal material Public/Granted day:2006-09-28
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