Invention Grant
US07651825B2 Method and system for overlay control using dual metrology sampling
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使用双重计量抽样的覆盖控制方法和系统
- Patent Title: Method and system for overlay control using dual metrology sampling
- Patent Title (中): 使用双重计量抽样的覆盖控制方法和系统
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Application No.: US11364541Application Date: 2006-03-01
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Publication No.: US07651825B2Publication Date: 2010-01-26
- Inventor: Franciscus Bernardus Maria Van Bilsen
- Applicant: Franciscus Bernardus Maria Van Bilsen
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: G03C5/00
- IPC: G03C5/00 ; G03F9/00
Abstract:
A system and method are provided for determining an overlay of a first layer N-1 and a second layer N that are positioned one over the other on a substrate. The first layer includes a first overlay portion. The second layer includes a first complementary overlay portion. The first overlay portion and first complementary overlay portion are arranged to form an overlay mark for determining the overlay of the first and second layers. In the second layer a stitching portion and a complementary stitching portion are formed. The stitching portion and complementary stitching portion are arranged to form a stitching mark for determining a stitching overlay between the second layer and an adjacent second layer, with the adjacent second layer being positioned adjacent to the second layer.
Public/Granted literature
- US20060210893A1 Method and system for overlay control using dual metrology sampling Public/Granted day:2006-09-21
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