Invention Grant
- Patent Title: Wafer lever fixture and method for packaging micro-electro-mechanical-system devices
- Patent Title (中): 晶圆杆夹具及包装微机电系统装置的方法
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Application No.: US12057949Application Date: 2008-03-28
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Publication No.: US07651888B2Publication Date: 2010-01-26
- Inventor: Hsueh An Yang
- Applicant: Hsueh An Yang
- Applicant Address: TW Pingtung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Pingtung
- Priority: TW96120677A 20070608
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L21/78 ; H01L21/52 ; H01L23/12
Abstract:
A fixture for packaging MEMS devices includes a base, a first material layer, an insulating layer and a second material layer. The base defines units, each including a notch. The first material layer is disposed on the base and the notches. The insulating layer is disposed on a part of the first material layer and exposes the other part of the first material layer located on the notches. The second material layer is disposed on the other part of the first material layer and formed with caps, whereby the caps are physically connected to the MEMS devices, and the MEMS devices are corresponding to the units of the base, wherein there is a first connecting force between the first and second material layers, there is a second connecting force between the caps and the MEMS devices, and the second connecting force is greater than the first connecting force.
Public/Granted literature
- US20090215228A1 WAFER LEVER FIXTURE AND METHOD FOR PACKAGING MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICES Public/Granted day:2009-08-27
Information query
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