Invention Grant
US07651889B2 Electromagnetic shield formation for integrated circuit die package
失效
电磁屏蔽形成用于集成电路管芯封装
- Patent Title: Electromagnetic shield formation for integrated circuit die package
- Patent Title (中): 电磁屏蔽形成用于集成电路管芯封装
-
Application No.: US11961827Application Date: 2007-12-20
-
Publication No.: US07651889B2Publication Date: 2010-01-26
- Inventor: Jinbang Tang , Darrel Frear , Jong-Kai Lin , Marc A. Mangrum , Robert E. Booth , Lawrence N. Herr , Kenneth R. Burch
- Applicant: Jinbang Tang , Darrel Frear , Jong-Kai Lin , Marc A. Mangrum , Robert E. Booth , Lawrence N. Herr , Kenneth R. Burch
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent David G. Dolezal
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.
Public/Granted literature
- US20090075428A1 ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE Public/Granted day:2009-03-19
Information query
IPC分类:
