Invention Grant
- Patent Title: Method for manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US11770999Application Date: 2007-06-29
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Publication No.: US07651894B2Publication Date: 2010-01-26
- Inventor: Myung Hwan Song
- Applicant: Myung Hwan Song
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2006-0097106 20061002; KR10-2007-0064268 20070628
- Main IPC: H01L21/82
- IPC: H01L21/82

Abstract:
A semiconductor device manufacturing method including forming a dummy capacitor in a fuse region to avoid a step height between plate electrodes in a cell region and in a fuse region, is disclosed herein. The method can be used so that only an insulating film at a target thickness may remain on an upper part of the plate electrode in the fuse region during an etching process for forming a fuse open region, and a fuse failure due to laser blowing can be prevented.
Public/Granted literature
- US20080081408A1 Method For Manufacturing Semiconductor Device Public/Granted day:2008-04-03
Information query
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