Invention Grant
- Patent Title: Hybrid substrates and methods for forming such hybrid substrates
- Patent Title (中): 混合基板和形成这种混合基板的方法
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Application No.: US11737989Application Date: 2007-04-20
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Publication No.: US07651902B2Publication Date: 2010-01-26
- Inventor: Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
- Applicant: Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L23/62

Abstract:
Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.
Public/Granted literature
- US20080258181A1 Hybrid Substrates and Methods for Forming Such Hybrid Substrates Public/Granted day:2008-10-23
Information query
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