Invention Grant
- Patent Title: Strained semiconductor device and method of making same
- Patent Title (中): 应变半导体器件及其制造方法
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Application No.: US11546662Application Date: 2006-10-12
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Publication No.: US07651915B2Publication Date: 2010-01-26
- Inventor: Jiang Yan , Danny Pak-Chum Shum
- Applicant: Jiang Yan , Danny Pak-Chum Shum
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/8247
- IPC: H01L21/8247

Abstract:
In a method of making a semiconductor device, a gate dielectric is formed over the semiconductor body. A floating gate is formed over the gate dielectric, an insulating region over the floating gate, and a control gate over the insulating region. The gate dielectric, floating gate, insulating region, and control gate constitute a gate stack. A stress is caused in the gate stack, whereby the band gap of the gate dielectric is changed by the stress.
Public/Granted literature
- US20080090350A1 Strained semiconductor device and method of making same Public/Granted day:2008-04-17
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