Invention Grant
- Patent Title: Vacuum expansion of integrated circuits at sort
- Patent Title (中): 集成电路的真空扩展分类
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Application No.: US11712717Application Date: 2007-03-01
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Publication No.: US07651925B2Publication Date: 2010-01-26
- Inventor: M. Todd Wyant
- Applicant: M. Todd Wyant
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact between a device being removed from the tape and an adjacent device on the tape. The combination includes a frame for holding edges of a tape carrying a plurality of singulated devices, and a vacuum chuck having upper surfaces for contacting an underside of a tape carrying a plurality of singulated devices. The vacuum chuck extends along a perimeter circumscribing the singulated devices, and at least one groove is defined in the upper surface of the vacuum chuck. Conduit for providing fluid communication between the groove and a vacuum source are provided. Upon evacuation of the volume defined between the groove and the tape, the tape is drawn down into the groove and stretched, thereby increasing the separation or gap between adjacent dice and reducing the risk of damage upon removal of the dice.
Public/Granted literature
- US20080213977A1 Vacuum expansion of integrated circuits at sort Public/Granted day:2008-09-04
Information query
IPC分类: