Invention Grant
US07651952B2 Aerodynamic shapes for wafer structures to reduce damage caused by cleaning processes
失效
用于晶片结构的空气动力学形状，以减少清洁过程造成的损坏
- Patent Title: Aerodynamic shapes for wafer structures to reduce damage caused by cleaning processes
- Patent Title (中): 用于晶片结构的空气动力学形状，以减少清洁过程造成的损坏
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Application No.: US11960662Application Date: 2007-12-19
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Publication No.: US07651952B2Publication Date: 2010-01-26
- Inventor: Christopher W. Bergevin , Shawn M. Collier Hernandez
- Applicant: Christopher W. Bergevin , Shawn M. Collier Hernandez
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Duft Bornsen & Fishman, LLP
- Main IPC: H01L21/461
- IPC: H01L21/461
Abstract:
Wafer structures and associated methods of fabrication are described. The wafer structures are fabricated to have aerodynamic shapes. Even if the structures on the wafer are fragile, the aerodynamic shapes of the structures create less resistance to a fluid flow of a cleaning process, and are less likely to be damaged by the cleaning process. Also, the aerodynamic shape of the structures allows a fluid flow to be directed toward the wafer from a single angle to effectively clean the wafer.
Public/Granted literature
- US20090162947A1 AERODYNAMIC SHAPES FOR WAFER STRUCTURES TO REDUCE DAMAGE CAUSED BY CLEANING PROCESSES Public/Granted day:2009-06-25
Information query
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