Invention Grant
- Patent Title: Patterning on surface with high thermal conductivity materials
- Patent Title (中): 具有高导热性材料的表面图案化
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Application No.: US11396999Application Date: 2006-04-03
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Publication No.: US07651963B2Publication Date: 2010-01-26
- Inventor: James D. B. Smith , Gary Stevens , John W. Wood
- Applicant: James D. B. Smith , Gary Stevens , John W. Wood
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B32B5/22
- IPC: B32B5/22 ; B32B5/16 ; B32B5/24 ; B32B5/30 ; B32B17/02 ; B32B17/06

Abstract:
The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.
Public/Granted literature
- US20060234576A1 Patterning on surface with high thermal conductivity materials Public/Granted day:2006-10-19
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