Invention Grant
US07652098B2 Resin composition for GHz-band electronic component and GHz-band electronic component
失效
用于GHz频带电子部件和GHz频带电子部件的树脂组合物
- Patent Title: Resin composition for GHz-band electronic component and GHz-band electronic component
- Patent Title (中): 用于GHz频带电子部件和GHz频带电子部件的树脂组合物
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Application No.: US10587950Application Date: 2005-02-02
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Publication No.: US07652098B2Publication Date: 2010-01-26
- Inventor: Kouichi Yamaguchi , Hidekazu Hayama , Ren-De Sun , Masahiro Yamada , Hitoshi Nishino , Yasunori Yokomichi
- Applicant: Kouichi Yamaguchi , Hidekazu Hayama , Ren-De Sun , Masahiro Yamada , Hitoshi Nishino , Yasunori Yokomichi
- Applicant Address: JP Osaka-Shi
- Assignee: Osaka Gas Co., Ltd
- Current Assignee: Osaka Gas Co., Ltd
- Current Assignee Address: JP Osaka-Shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2004-027996 20040204; JP2004-376806 20041227
- International Application: PCT/JP2005/001868 WO 20050202
- International Announcement: WO2005/075571 WO 20050818
- Main IPC: C08K3/04
- IPC: C08K3/04
Abstract:
The present invention relates to a resin composition for GHz-band electronic components, the composition comprising nanoscale carbon tubes and at least one member selected from the group consisting of thermoplastic resins, curable resins, and composite resins of thermoplastic resins and curable resins; wherein the nanoscale carbon tubes are present in an amount of 0.0001 to 0.4 wt. % based on the resin; and an electronic component obtainable from the resin composition, or the like.
Public/Granted literature
- US20070129481A1 Resin composition for ghz-band electronic component and ghz-band electronic component Public/Granted day:2007-06-07
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