Invention Grant
US07652229B2 Electrical heating arrangement 有权
电加热布置

  • Patent Title: Electrical heating arrangement
  • Patent Title (中): 电加热布置
  • Application No.: US10587411
    Application Date: 2005-02-02
  • Publication No.: US07652229B2
    Publication Date: 2010-01-26
  • Inventor: Brian Roger AlvesStuart Lamb
  • Applicant: Brian Roger AlvesStuart Lamb
  • Applicant Address: GB Cardiff
  • Assignee: Stylewell Limited
  • Current Assignee: Stylewell Limited
  • Current Assignee Address: GB Cardiff
  • Agent Ira S. Dorman
  • Priority: GB0402412.1 20040204
  • International Application: PCT/GB2005/000368 WO 20050202
  • International Announcement: WO2005/076667 WO 20050818
  • Main IPC: H05B3/68
  • IPC: H05B3/68
Electrical heating arrangement
Abstract:
A temperature sensor assembly (30) is provided for an electrical heating arrangement (2). The temperature sensor assembly (30) includes a substrate (32) located in a heater (12). The substrate (32) has an upper surface (38) in contact with the lower surface (10) of a cooking plate (4). The upper and/or lower surface or surfaces (38, 66) of the substrate (32) is provided with a first temperature-sensitive resistance element (40) at a first region (42) of the substrate (32) proximate a peripheral region (34) of the heater. The upper (38) and/or lower (66) surface or surfaces of the substrate (32) is or are provided with a second temperature-sensitive resistance element (54; 54A; 54B) at a second region (56) of the substrate (32) proximate the central region (36) of the heater. A support member (70; 102) is secured to the substrate (32) and underlies at least the first region (42) of the substrate (32) and thermal insulation means (74) is interposed between the lower surface (66) of the substrate (32) and the support member (70) only at the first region (42) of the substrate (32).
Public/Granted literature
Information query
Patent Agency Ranking
0/0