Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
- Patent Title (中): 半导体器件及其制造方法相同
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Application No.: US11072632Application Date: 2005-03-07
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Publication No.: US07652321B2Publication Date: 2010-01-26
- Inventor: Tetsuji Yamaguchi , Kiyoshi Kato
- Applicant: Tetsuji Yamaguchi , Kiyoshi Kato
- Applicant Address: JP Atsugi-shi, Kanagawa-Ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-Ken
- Agency: Nixon Peabody, LLP
- Agent Jeffrey L. Costellia
- Priority: JP2004-063901 20040308
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
In a process of manufacturing elements of different structures and characteristics on the same substrate at the same time, the number of steps is increased and complicated. In view of this, the invention provides a semiconductor device and a manufacturing process thereof in which elements of different structures are formed on the same substrate while reducing the number of steps. According to the invention, in accordance with a memory transistor that requires the largest number of steps when being formed among elements that forms a semiconductor memory device, other high speed transistor and high voltage transistor are efficiently manufactured. Thus, the number of steps is suppressed and a low cost semiconductor memory device can be manufactured.
Public/Granted literature
- US20050194645A1 Semiconductor device and manufacturing method of the same Public/Granted day:2005-09-08
Information query
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