Invention Grant
- Patent Title: Semiconductor device and manufacturing method for semiconductor device
- Patent Title (中): 半导体装置及半导体装置的制造方法
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Application No.: US11365871Application Date: 2006-03-02
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Publication No.: US07652327B2Publication Date: 2010-01-26
- Inventor: Atsushi Kaneko
- Applicant: Atsushi Kaneko
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2005-072600 20050315
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
To provide a semiconductor device capable of reducing a gate capacitance, and preventing breakdown of a gate oxide film if a large amount of current flows. A semiconductor device according to an embodiment of the present invention includes: an epitaxial layer; a channel region formed on the epitaxial layer; a trench extending from a surface of the channel region to the epitaxial layer; a gate oxide film that covers an inner surface of the trench; a gate electrode filled into the trench; and a buried insulating film formed below the gate electrode and away from the gate oxide film.
Public/Granted literature
- US20060208314A1 Semiconductor device and manufacturing method for semiconductor device Public/Granted day:2006-09-21
Information query
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