Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11853064Application Date: 2007-09-11
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Publication No.: US07652344B2Publication Date: 2010-01-26
- Inventor: Shinichi Uchida
- Applicant: Shinichi Uchida
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2006-247031 20060912
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor device that can suppress noise transmission through a seal ring provided between two device regions. The semiconductor device includes a logic unit and an analog unit. The semiconductor device further includes a silicon substrate, an insulating interlayer, a seal ring surrounding the outer periphery of the logic unit composed of a conductive film buried in the insulating interlayer, a well provided on the silicon substrate, and an N well guard ring that blocks conduction of a path from the logic unit, through the seal ring to the analog unit. The N well guard ring is disposed between the seal ring region 106 and the logic unit or the analog unit.
Public/Granted literature
- US20080061397A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-03-13
Information query
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