Electronic device and method of manufacturing the same

Invention Grant

US07652360B2 Electronic device and method of manufacturing the same 失效

Title translation: 电子设备及其制造方法

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Patent Title: Electronic device and method of manufacturing the same
Patent Title (中): 电子设备及其制造方法
Application No.: US11696028

Application Date: 2007-04-03
Publication No.: US07652360B2

Publication Date: 2010-01-26
Inventor: Mitsuo Usami
Applicant: Mitsuo Usami
Applicant Address: JP Tokyo
Assignee: Hitachi, Ltd.
Current Assignee: Hitachi, Ltd.
Current Assignee Address: JP Tokyo
Agency: Miles & Stockbridge P.C.
Priority: JP2001-069615 20010313
Main IPC: H01L23/02
IPC: H01L23/02

Electronic device and method of manufacturing the same

Abstract:

An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Abstract(Chinese):

其中将平板半导体和连接到半导体的前表面和后表面上的表面电极的引线和引线封装在玻璃管中的电子器件。

Public/Granted literature

US20070190699A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2007-08-16

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）