Invention Grant
US07652366B2 Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package
有权
LCD驱动IC芯片的贴片布置及相关电路图案结构的贴片封装
- Patent Title: Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package
- Patent Title (中): LCD驱动IC芯片的贴片布置及相关电路图案结构的贴片封装
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Application No.: US12189039Application Date: 2008-08-08
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Publication No.: US07652366B2Publication Date: 2010-01-26
- Inventor: Ye-Chung Chung , Si-Hoon Lee
- Applicant: Ye-Chung Chung , Si-Hoon Lee
- Applicant Address: KR Maetan-dong, Yeongtong-gu, Suwon-si Gyeonggi-do
- Assignee: Samsung Electronics Co. Ltd.
- Current Assignee: Samsung Electronics Co. Ltd.
- Current Assignee Address: KR Maetan-dong, Yeongtong-gu, Suwon-si Gyeonggi-do
- Agency: Muir Patent Counsulting, PLLC
- Priority: KR2004-90666 20041109
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L23/495 ; H01L29/40 ; H01L23/485 ; H01L23/498
Abstract:
Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.
Public/Granted literature
- US20080303148A1 PAD ARRANGEMENT OF DRIVER IC CHIP FOR LCD AND RELATED CIRCUIT PATTERN STRUCTURE OF TAB PACKAGE Public/Granted day:2008-12-11
Information query
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