Invention Grant
US07652367B2 Semiconductor package on package having plug-socket type wire connection between packages
有权
封装上的半导体封装，在封装之间具有插头型导线连接
- Patent Title: Semiconductor package on package having plug-socket type wire connection between packages
- Patent Title (中): 封装上的半导体封装，在封装之间具有插头型导线连接
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Application No.: US11959557Application Date: 2007-12-19
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Publication No.: US07652367B2Publication Date: 2010-01-26
- Inventor: Kyung-Lae Jang , Kwon-Young Roh
- Applicant: Kyung-Lae Jang , Kwon-Young Roh
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F.Chau & Associates, LLC
- Priority: KR10-2006-0133153 20061222
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package on package includes a tower package, an upper package stacked over the lower package, a plug wire combined to any one of an upper portion of the tower package and a lower portion of the upper package, and a socket wire combined to any one of the upper portion of the lower package and the lower portion of the upper package. The plug wire is plugged into the socket wire to electrically connect the upper and lower packages.
Public/Granted literature
- US20080150116A1 SEMICONDUCTOR PACKAGE ON PACKAGE HAVING PLUG-SOCKET TYPE WIRE CONNECTION BETWEEN PACKAGES Public/Granted day:2008-06-26
Information query
IPC分类:
